DocumentCode :
1277639
Title :
Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator
Author :
Yeh, Jer-Liang Andrew ; Jiang, Hongrui ; Tien, Norman C.
Author_Institution :
Cornell Univ., Ithaca, NY, USA
Volume :
8
Issue :
4
fYear :
1999
fDate :
12/1/1999 12:00:00 AM
Firstpage :
456
Lastpage :
465
Abstract :
This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows the combdrive to be integrated with any structure made by polysilicon surface micromachining
Keywords :
electrostatic actuators; elemental semiconductors; micromachining; silicon; sputter etching; torsion; Si; bulk silicon micromachining; deep reactive ion etching; electrostatic torsional actuator; fabrication; polysilicon surface micromachining; Anisotropic magnetoresistance; Biomembranes; Electrostatic actuators; Etching; Fabrication; Fingers; Micromachining; Resonant frequency; Silicon; Surface topography;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/84.809061
Filename :
809061
Link To Document :
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