DocumentCode :
1278980
Title :
Solder side up ¿ the move to surface mounting
Author :
Dettmer, Roger
Volume :
30
Issue :
2
fYear :
1984
fDate :
2/1/1984 12:00:00 AM
Firstpage :
117
Lastpage :
120
Abstract :
Technical and commercial pressures are forcing changes in the shape of electronic components and the way they are mounted. The most obvious manifestation of this trend is a move to surface mounting, so eliminating the need for leads on components and plated through holes on PCBs. This apparently simple change has serious implications for the electronics industry.
fLanguage :
English
Journal_Title :
Electronics and Power
Publisher :
iet
ISSN :
0013-5127
Type :
jour
DOI :
10.1049/ep.1984.0066
Filename :
5187250
Link To Document :
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