DocumentCode :
1279166
Title :
Thin oxide thickness extrapolation from capacitance-voltage measurements
Author :
Walstra, Steven V. ; Sah, Chih-Tang
Author_Institution :
Solid-State Electron. Lab., Florida Univ., Gainesville, FL, USA
Volume :
44
Issue :
7
fYear :
1997
fDate :
7/1/1997 12:00:00 AM
Firstpage :
1136
Lastpage :
1142
Abstract :
Five oxide-thickness extrapolation algorithms, all based on the same model (metal gate, negligible interface traps, no quantum effects), are compared to determine their accuracy. Three sets of parameters are used: (acceptor impurity concentration, oxide thickness, and temperature): (1016 cm-3, 250 Å, 300 K), (5×1017 Cm-3, 250 Å, 300 K), and (5×1017 cm-3, 50 Å, 150 K). Demonstration examples show that a new extrapolation method, which includes Fermi-Dirac statistics, gives the most accurate results, while the widely-used Co≃Cg (measured at the power supply voltage) is the least accurate. The effect of polycrystalline silicon gate is also illustrated
Keywords :
MOS capacitors; capacitance; extrapolation; impurity distribution; thickness measurement; 150 K; 250 angstrom; 300 K; 50 angstrom; C-V characteristics; Fermi-Dirac statistics; Si-SiO2; acceptor impurity concentration; capacitance-voltage measurements; gate depletion effect; impurity deionization; metal-gate MOS capacitor; model; oxide-thickness extrapolation algorithms; polycrystalline silicon gate; temperature; Capacitance-voltage characteristics; Extrapolation; Impurities; Power measurement; Power supplies; Silicon; Statistics; Temperature distribution; Thickness measurement; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.595942
Filename :
595942
Link To Document :
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