DocumentCode
1279361
Title
Fabrication of sub-spot-size microchannel of microfluidic chip using CO2 laser processing with metal-film protection
Author
Chung, C.K. ; Tan, T.K. ; Lin, S.L. ; Tu, K.Z. ; Lai, Chun Chi
Author_Institution
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Volume
7
Issue
8
fYear
2012
fDate
8/1/2012 12:00:00 AM
Firstpage
736
Lastpage
739
Abstract
CO2 laser ablation has been a popular technique for microfluidic chip fabrication but it always suffers some problems such as bulges, clogging, re-solidification and large heat-affected zone around the rim of channels and holes. In this Letter, a simple effective method for diminishing the defects has been proposed using a metal-film protection for CO2 laser ablation. Polymethylmethancrylate (PMMA) was used as a substrate to demonstrate the fabricated microfluidic channels without clogging as well as bulges reduced. The feature size of the microchannel can also distinctly be decreased from 268 m in air to around 58 m with metal-film-protection method, which is smaller than the laser-beam spot size. The bulge height was reduced to less than 0.2 m and clogging effect in the channel junction was not occurred. ANSYS simulation was also used to analyse the temperature distribution on PMMA substrate during laser ablation in air and with metal-film protection. The method presented here is suitable for microfluidic device production while overcoming the bad surface quality and low-resolution limit of CO2 laser ablation in air.
Keywords
laser ablation; microchannel flow; temperature distribution; ANSYS simulation; bulge height; carbon dioxide laser ablation; carbon dioxide laser processing; channel junction; channel rim; clogging effect; heat-affected zone; hole rim; low-resolution limit; metal-film-protection method; microchannel size; microfluidic channels; microfluidic chip fabrication; microfluidic device production; polymethylmethancrylate substrate; resolidification; size 268 mum; subspot-size microchannel fabrication; surface quality; temperature distribution;
fLanguage
English
Journal_Title
Micro & Nano Letters, IET
Publisher
iet
ISSN
1750-0443
Type
jour
DOI
10.1049/mnl.2012.0385
Filename
6294594
Link To Document