• DocumentCode
    1280651
  • Title

    Simple cost models of high-process-mix wafer fabs at different capacities

  • Author

    Iwata, Yoshio ; Wood, Samuel C.

  • Author_Institution
    Manuf. Syst. Technol. Dept., Hitachi Ltd., Ibaraki, Japan
  • Volume
    15
  • Issue
    2
  • fYear
    2002
  • fDate
    5/1/2002 12:00:00 AM
  • Firstpage
    267
  • Lastpage
    273
  • Abstract
    A simple equation-based model of wafer cost as a function of fab capacity is derived by splitting fixed costs into capacity-dependent and capacity-independent components. Simple approximations are presented for these terms. Our model uses Sematech data to show how the following phenomena can be measured: 1) increasing process diversity motivates larger fabs; 2) dedicating tools to eliminate setups motivates larger fabs; 3) slow, cheap, versatile tools are better than fast, expensive, dedicated tools when implementing flexible minifabs
  • Keywords
    cost-benefit analysis; integrated circuit economics; semiconductor process modelling; Sematech data; capacity-dependent components; capacity-independent components; cost models; equation-based model; fab capacity; flexible minifabs; high-process-mix wafer fabs; manufacturing economics; manufacturing planning; process diversity; setup elimination; slow cheap versatile tools; wafer cost; Analytical models; Cost function; DRAM chips; Differential equations; Industrial economics; Manufacturing industries; Mass production; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor devices;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.999603
  • Filename
    999603