DocumentCode
1280651
Title
Simple cost models of high-process-mix wafer fabs at different capacities
Author
Iwata, Yoshio ; Wood, Samuel C.
Author_Institution
Manuf. Syst. Technol. Dept., Hitachi Ltd., Ibaraki, Japan
Volume
15
Issue
2
fYear
2002
fDate
5/1/2002 12:00:00 AM
Firstpage
267
Lastpage
273
Abstract
A simple equation-based model of wafer cost as a function of fab capacity is derived by splitting fixed costs into capacity-dependent and capacity-independent components. Simple approximations are presented for these terms. Our model uses Sematech data to show how the following phenomena can be measured: 1) increasing process diversity motivates larger fabs; 2) dedicating tools to eliminate setups motivates larger fabs; 3) slow, cheap, versatile tools are better than fast, expensive, dedicated tools when implementing flexible minifabs
Keywords
cost-benefit analysis; integrated circuit economics; semiconductor process modelling; Sematech data; capacity-dependent components; capacity-independent components; cost models; equation-based model; fab capacity; flexible minifabs; high-process-mix wafer fabs; manufacturing economics; manufacturing planning; process diversity; setup elimination; slow cheap versatile tools; wafer cost; Analytical models; Cost function; DRAM chips; Differential equations; Industrial economics; Manufacturing industries; Mass production; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor devices;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.999603
Filename
999603
Link To Document