DocumentCode :
1280705
Title :
Interconnection channel capacity under crosstalk noise
Author :
Ziv, Ofer ; Constable, James H.
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Volume :
41
Issue :
4
fYear :
1999
fDate :
11/1/1999 12:00:00 AM
Firstpage :
361
Lastpage :
365
Abstract :
The channel capacity of a parallel bus structure was examined in relation to the ever increasing demand for signal input and output. The limitations on signal integrity caused by both far-end and near-end crosstalk noise were considered. Expressions for the signal waveforms were developed using a rudimentary model. The expressions were then used to evaluate the channel capacity for perfectly matched lines in the high-frequency regime where skin effect and dielectric loss dominate the loss due to the static resistance. The analysis showed that binary logic yields the maximum channel capacity. For the parameters assumed as an illustrative example, the input rise time needed to achieve the maximum channel capacity cannot be achieved with today´s technology. For source rise times longer than this threshold or optimum rise time, the maximum channel capacity is achieved by using multilevel logic. In the case of short lines, insufficient coupling exists between lines to meet the channel capacity condition for two levels. Therefore, for short lines multiple logic also is necessary to achieve maximum channel capacity
Keywords :
channel capacity; crosstalk; dielectric losses; integrated circuit interconnections; multivalued logic; noise; skin effect; system buses; transmission lines; IC packages; binary logic; dielectric loss; far-end crosstalk noise; high-frequency regime; input rise time; interconnection channel capacity; maximum channel capacity; near-end crosstalk noise; optimum rise time; parallel bus structure; perfectly matched lines; short lines; signal input; signal integrity; signal output; signal waveforms; skin effect; source rise time; static resistance; Channel capacity; Communication industry; Coupling circuits; Crosstalk; Dielectric losses; Frequency; Integrated circuit interconnections; Integrated circuit packaging; Logic; Skin effect;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/15.809819
Filename :
809819
Link To Document :
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