• DocumentCode
    1280761
  • Title

    Analysis of 3-D interconnect structures with PEEC using SPICE

  • Author

    Wollenberg, Günter ; Gurisch, A.

  • Author_Institution
    Otto-von-Guericke Univ., Magdeburg, Germany
  • Volume
    41
  • Issue
    4
  • fYear
    1999
  • fDate
    11/1/1999 12:00:00 AM
  • Firstpage
    412
  • Lastpage
    417
  • Abstract
    This paper discusses the possibilities of using the circuit simulation program, simulation program with integrated circuit emphasis (SPICE) for the simulation of partial element equivalent circuit (PEEC) models. After an introduction into the PEEC method, the simulation of quasi-stationary models is considered. An enhancement of SPICE is described, allowing the simulation of retarded PEEC models. This enables the computation of electric fields radiated from an interconnection structure. With the modified SPICE simulator it is possible to use existing SPICE models and combine them with full wave PEEC models
  • Keywords
    SPICE; circuit simulation; electric fields; electromagnetic compatibility; electromagnetic interference; equivalent circuits; integrated circuit interconnections; 3D interconnect structures; EFIE; EMC; EMI; circuit simulation program; electric field integral equation; full wave PEEC models; interconnection structure; modified SPICE simulator; partial element equivalent circuit models; quasi-stationary models simulation; radiated electric fields; retarded PEEC models; simulation program with integrated circuit emphasis; transmission line model; Analytical models; Circuit simulation; Computational modeling; Current density; Electromagnetic compatibility; Equivalent circuits; Integral equations; Integrated circuit interconnections; Integrated circuit modeling; SPICE;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/15.809841
  • Filename
    809841