DocumentCode
1280761
Title
Analysis of 3-D interconnect structures with PEEC using SPICE
Author
Wollenberg, Günter ; Gurisch, A.
Author_Institution
Otto-von-Guericke Univ., Magdeburg, Germany
Volume
41
Issue
4
fYear
1999
fDate
11/1/1999 12:00:00 AM
Firstpage
412
Lastpage
417
Abstract
This paper discusses the possibilities of using the circuit simulation program, simulation program with integrated circuit emphasis (SPICE) for the simulation of partial element equivalent circuit (PEEC) models. After an introduction into the PEEC method, the simulation of quasi-stationary models is considered. An enhancement of SPICE is described, allowing the simulation of retarded PEEC models. This enables the computation of electric fields radiated from an interconnection structure. With the modified SPICE simulator it is possible to use existing SPICE models and combine them with full wave PEEC models
Keywords
SPICE; circuit simulation; electric fields; electromagnetic compatibility; electromagnetic interference; equivalent circuits; integrated circuit interconnections; 3D interconnect structures; EFIE; EMC; EMI; circuit simulation program; electric field integral equation; full wave PEEC models; interconnection structure; modified SPICE simulator; partial element equivalent circuit models; quasi-stationary models simulation; radiated electric fields; retarded PEEC models; simulation program with integrated circuit emphasis; transmission line model; Analytical models; Circuit simulation; Computational modeling; Current density; Electromagnetic compatibility; Equivalent circuits; Integral equations; Integrated circuit interconnections; Integrated circuit modeling; SPICE;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/15.809841
Filename
809841
Link To Document