DocumentCode :
1281468
Title :
Emitter size effect on current gain in fully self-aligned AlGaAs/GaAs HBT´s with AlGaAs surface passivation layer
Author :
Hayama, Nobuyuki ; Honjo, Kazuhiko
Author_Institution :
NEC Corp., Kawasaki, Japan
Volume :
11
Issue :
9
fYear :
1990
Firstpage :
388
Lastpage :
390
Abstract :
The emitter size effect for fully self-aligned AlGaAs-GaAs heterojunction bipolar transistors (HBTs) with depleted AlGaAs passivation layers, in which the partially thinned AlGaAs emitter is self-aligned by using the dual sidewall process, is investigated. It is demonstrated that drastic improvement in the emitter size effect can be achieved with an AlGaAs passivation layer as small as 0.2 mu m in width, due to the surface recombination current reduction by a factor of 1/40 in the extrinsic base region. It has also been found that the base current is dominated by excess leakage current in the proton-implanted isolation region.<>
Keywords :
III-V semiconductors; aluminium compounds; gallium arsenide; heterojunction bipolar transistors; passivation; semiconductor technology; 0.2 micron; AlGaAs surface passivation layer; AlGaAs-GaAs; HBTs; base current; current gain; depleted AlGaAs passivation layers; dual sidewall process; emitter size effect; excess leakage current; extrinsic base region; fully self-aligned HBTs; heterojunction bipolar transistors; partially thinned AlGaAs emitter; proton-implanted isolation region; semiconductors; surface recombination current reduction; Circuits; Dry etching; Electrodes; Fabrication; Gallium arsenide; Heterojunction bipolar transistors; Leakage current; Microwave devices; Molecular beam epitaxial growth; Passivation;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.62965
Filename :
62965
Link To Document :
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