Low cost, integrated 4-element laser arrays with passive fibre alignment for optical data communications links

Author

Thom, E.M. ; Williams, P.J. ; Hall, J.P. ; Robbins, D.J. ; Fine, J.M. ; Kearley, M.Q.

Author_Institution

GEC-Marconi Mater. Technol. Ltd., Towcester, UK

Volume

33

Issue

18

fYear

1997

fDate

8/28/1997 12:00:00 AM

Firstpage

1551

Lastpage

1553

Abstract

The design, fabrication and characterisation of 4-element laser arrays operating at 1300 nm for use in low cost data communication links is described. The design or the chip and package incorporated flip-chip solder bonding to achieve passive alignment of the laser elements to optical fibre. Individual elements exhibited lasing threshold currents of <20 mA with output powers >30 mW at a drive current of 100 mA. Coupling efficiencies of up to 10% into singlemode optical fibre were achieved by laser modules fabricated using passive alignment techniques. At a drive current of 70 mA, the small signal 3 dB bandwidth of the devices was 5 GHz

Keywords

data communication equipment; flip-chip devices; laser beam applications; modules; optical fabrication; optical transmitters; semiconductor device packaging; semiconductor laser arrays; 1300 nm; 20 mA; 30 mW; 5 GHz; 70 to 100 mA; characterisation; fabrication; flip-chip solder bonding; integrated 4-element laser arrays; laser modules; optical data communications links; package; passive fibre alignment; singlemode optical fibre;

fLanguage

English

Journal_Title

Electronics Letters

Publisher

iet

ISSN

0013-5194

Type

jour

DOI

10.1049/el:19971033

Filename

629653