• DocumentCode
    1282132
  • Title

    MOCVD-grown 0.25- mu m MESFET´s using tertiary butyl arsine as the arsenic source

  • Author

    Mao, Bor-yen ; Sundaram, V.S. ; Zurek, S.J. ; Levy, H.W. ; Martin, G.H. ; Fraas, L.M. ; Lee, Gi-young

  • Author_Institution
    Boeing Aerosp. & Electron., Seattle, WA, USA
  • Volume
    11
  • Issue
    9
  • fYear
    1990
  • Firstpage
    397
  • Lastpage
    399
  • Abstract
    High-performance 0.25- mu m-gate MESFETs on MOCVD-grown epitaxial structure have been fabricated using tertiary butyl arsine (TBA) as the arsenic source. TBA, a liquid-phase organometallic arsenic compound, is a promising alternate arsenic source due to its lower vapor pressure, which makes it safer to handle than arsine. DC characterizations show that the extrinsic peak transconductance is 508 mS/mm. From on-wafer S-parameter measurements, the MESFETs show a current-gain cutoff frequency of 55 GHz and a maximum-available-gain cutoff frequency of 93 GHz. These results represent the best results reported for MOCVD-grown MESFETs using a TBA source and compare favorably with the previously reported f/sub t/ of 40 GHz for molecular beam epitaxy (MBE)-grown MESFETs.<>
  • Keywords
    III-V semiconductors; Schottky gate field effect transistors; chemical vapour deposition; gallium arsenide; semiconductor epitaxial layers; semiconductor growth; solid-state microwave devices; vapour phase epitaxial growth; As source; DC characterizations; GaAs growth; MOCVD-grown MESFETs; MOCVD-grown epitaxial structure; TBA; current-gain cutoff frequency; extrinsic peak transconductance; liquid-phase organometallic arsenic compound; maximum-available-gain cutoff frequency; on-wafer S-parameter measurements; safer to handle; semiconductors; tertiary butyl arsine; vapor pressure; Doping; Epitaxial layers; Gallium arsenide; Lithography; MESFETs; MOCVD; Metallization; Substrates; Threshold voltage; Transconductance;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.62968
  • Filename
    62968