DocumentCode
1282216
Title
Towards Achieving the Soft-Punch-Through Superjunction Insulated-Gate Bipolar Transistor Breakdown Capability
Author
Antoniou, Marina ; Udrea, Florin ; Bauer, Friedhelm ; Mihaila, Andrei ; Nistor, Iulian
Author_Institution
Dept. of Electr. Eng., Univ. of Cambridge, Cambridge, UK
Volume
32
Issue
9
fYear
2011
Firstpage
1275
Lastpage
1277
Abstract
The termination design of superjunction (SJ) structures has always been a conceptual and technological challenge. In this letter, we propose new, optimized, elegant, and cost-efficient solutions toward the realization of the first 1.2-kV rated SJ insulated-gate bipolar transistor. The design is based on the utilization of existing layers in the device fabrication line, hence resulting in no extra complexity or cost increase. The proposed design effectiveness is confirmed through extensive numerical simulations.
Keywords
design; insulated gate bipolar transistors; numerical analysis; breakdown capability; numerical simulations; soft-punch-through superjunction insulated-gate bipolar transistor; superjunction structures; termination design; Cathodes; Doping; Electric breakdown; Electric potential; Fabrication; Insulated gate bipolar transistors; Junctions; Insulated Gate Bipolar Transistor (IGBT); superjunction (SJ); termination;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2011.2160930
Filename
5961605
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