DocumentCode :
1282216
Title :
Towards Achieving the Soft-Punch-Through Superjunction Insulated-Gate Bipolar Transistor Breakdown Capability
Author :
Antoniou, Marina ; Udrea, Florin ; Bauer, Friedhelm ; Mihaila, Andrei ; Nistor, Iulian
Author_Institution :
Dept. of Electr. Eng., Univ. of Cambridge, Cambridge, UK
Volume :
32
Issue :
9
fYear :
2011
Firstpage :
1275
Lastpage :
1277
Abstract :
The termination design of superjunction (SJ) structures has always been a conceptual and technological challenge. In this letter, we propose new, optimized, elegant, and cost-efficient solutions toward the realization of the first 1.2-kV rated SJ insulated-gate bipolar transistor. The design is based on the utilization of existing layers in the device fabrication line, hence resulting in no extra complexity or cost increase. The proposed design effectiveness is confirmed through extensive numerical simulations.
Keywords :
design; insulated gate bipolar transistors; numerical analysis; breakdown capability; numerical simulations; soft-punch-through superjunction insulated-gate bipolar transistor; superjunction structures; termination design; Cathodes; Doping; Electric breakdown; Electric potential; Fabrication; Insulated gate bipolar transistors; Junctions; Insulated Gate Bipolar Transistor (IGBT); superjunction (SJ); termination;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2011.2160930
Filename :
5961605
Link To Document :
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