• DocumentCode
    1282216
  • Title

    Towards Achieving the Soft-Punch-Through Superjunction Insulated-Gate Bipolar Transistor Breakdown Capability

  • Author

    Antoniou, Marina ; Udrea, Florin ; Bauer, Friedhelm ; Mihaila, Andrei ; Nistor, Iulian

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Cambridge, Cambridge, UK
  • Volume
    32
  • Issue
    9
  • fYear
    2011
  • Firstpage
    1275
  • Lastpage
    1277
  • Abstract
    The termination design of superjunction (SJ) structures has always been a conceptual and technological challenge. In this letter, we propose new, optimized, elegant, and cost-efficient solutions toward the realization of the first 1.2-kV rated SJ insulated-gate bipolar transistor. The design is based on the utilization of existing layers in the device fabrication line, hence resulting in no extra complexity or cost increase. The proposed design effectiveness is confirmed through extensive numerical simulations.
  • Keywords
    design; insulated gate bipolar transistors; numerical analysis; breakdown capability; numerical simulations; soft-punch-through superjunction insulated-gate bipolar transistor; superjunction structures; termination design; Cathodes; Doping; Electric breakdown; Electric potential; Fabrication; Insulated gate bipolar transistors; Junctions; Insulated Gate Bipolar Transistor (IGBT); superjunction (SJ); termination;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2160930
  • Filename
    5961605