DocumentCode
1283561
Title
Low-Frequency Noise Characterization of Strained Germanium pMOSFETs
Author
Simoen, E. ; Mitard, Jérôme ; De Jaeger, B. ; Eneman, G. ; Dobbie, Andy ; Myronov, Maksym ; Whall, Terence E. ; Leadley, David R. ; Meuris, Marc ; Hoffmann, T. ; Claeys, C.
Author_Institution
Interuniversity Microelectron. Center, Leuven, Belgium
Volume
58
Issue
9
fYear
2011
Firstpage
3132
Lastpage
3139
Abstract
Low-frequency noise in strained Ge epitaxial layers, which are grown on a reverse-graded relaxed SiGe buffer layer, has been evaluated for different front-end processing conditions. It has been shown that the 1/f noise in strong inversion is governed by trapping in the gate oxide (number fluctuations) and not affected by the presence of compressive strain in the channel. However, some impact has been found from the type of halo implantation used, whereby the lowest noise spectral density and the highest hole mobility are obtained by replacing the standard As halo by P implantation. At the same time, omitting the junction anneal results in poor device characteristics, which can be understood by considering the presence of a high density of nonannealed implantation damage in the channel and the gate stack near the source and the drain.
Keywords
1/f noise; MOSFET; buffer layers; compressive strength; epitaxial layers; germanium; hole mobility; ion implantation; semiconductor device noise; semiconductor junctions; 1/f noise; Ge; compressive strain; epitaxial layers; front-end processing conditions; gate oxide; gate stack; halo implantation; hole mobility; ion implantation; junction anneal results; low-frequency noise characterization; nonannealed implantation damage; reverse-graded relaxed buffer layer; spectral density; strained germanium pMOSFET; Logic gates; Low-frequency noise; MOSFETs; Silicon; Substrates; Generation–recombination (GR) noise; hole mobility; low-frequency (LF) noise; strained and relaxed germanium;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2011.2160679
Filename
5962354
Link To Document