• DocumentCode
    1284056
  • Title

    Investigation of Modeling System ESD Failure and Probability Using IBIS ESD Models

  • Author

    Monnereau, Nicolas ; Caignet, Fabrice ; Nolhier, Nicolas ; Bafleur, Marise ; Trémouilles, David

  • Volume
    12
  • Issue
    4
  • fYear
    2012
  • Firstpage
    599
  • Lastpage
    606
  • Abstract
    Due to growing number of embedded electronics, estimating failure related to system-level electrostatic discharge (ESD) consideration has become a major concern. In this paper, a behavioral modeling methodology to predict ESD failures at system level is proposed and validated. The proposed models enable time-domain simulation to determine the voltage and current waveforms inside and outside an integrated circuit during ESD events and then to predict the susceptibility of an electronic system to ESD. The purpose of this methodology is based on the improvement of Input/output Buffer Information Specification files widely used in signal integrity simulation. A simple case study is proposed to investigate the susceptibility of latch devices to transient stresses. Simulations and measurements are compared. Analytical formulations to determine the probability of susceptibility failure are proposed and compared with measurements.
  • Keywords
    electrostatic discharge; flip-flops; integrated circuit modelling; probability; time-domain analysis; IBIS ESD model; current waveform determination; embedded electronics; input-output buffer information specification file; integrated circuit; latch device susceptibility; modeling system ESD failure estimation; probability; signal integrity simulation; system-level electrostatic discharge; time-domain simulation; transient stress; voltage waveform determination; Clocks; Electrostatic discharges; Integrated circuit modeling; Stress; Synchronization; Thyristors; Behavioral modeling; ElectroMagnetic Compatibility (EMC); Electrostatic discharge (ESD); Input Output Buffer Information Specification (IBIS);
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2012.2218605
  • Filename
    6301685