Enhanced polymer ablation rates using high-repetition-rate ultraviolet lasers

Author

Illy, Elizabeth K. ; Brown, Daniel J.W. ; Withford, Michael J. ; Piper, James A.

Author_Institution

Dept. of Phys., Macquarie Univ., North Ryde, NSW, Australia

Volume

5

Issue

6

fYear

1999

Firstpage

1543

Lastpage

1548

Abstract

Etch rates (μm/pulse) for glycol-modified polyethylene terephthalate (PETG) under pulsed UV (255 nm) laser processing are measured as a function of pulse repetition frequency in the range 0.7-15 kHz. Materials removal rates (μm/s) scale approximately linearly with pulse repetition frequency at a fluence of 0.59 J/cm², and there appears to be no attenuation of the ablating laser beam by the ejected material plume for pulse rates up to 15 kHz. The instantaneous etch rate for pulses in a sequence increases markedly (~40%) for long pulse sequences (>100 pulses) at high PRF (15 kHz), an effect which can be used to increase machining rates while operating at a moderate laser fluence

Keywords

laser ablation; laser beam etching; laser beam machining; micromachining; polymers; 255 nm; ablating laser beam; ejected material plume; enhanced polymer ablation rates; etch rates; glycol-modified polyethylene terephthalate; high-repetition-rate ultraviolet lasers; long pulse sequences; machining rates; materials removal rates; moderate laser fluence; pulse repetition frequency; pulsed UV laser processing; Etching; Frequency measurement; Laser ablation; Linear approximation; Optical attenuators; Optical materials; Optical pulses; Polyethylene; Polymers; Pulse measurements;

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/2944.814996

Filename

814996