• DocumentCode
    128691
  • Title

    Simulation and optimization of a micro-machined silicon condenser microphone using a perforated diaphragm

  • Author

    Duan Zhang ; Qi Fang ; Xiongxiong He

  • Author_Institution
    Zhejiang Provincial Key Lab. for Signal Process., Zhejiang Univ. of Technol., Hangzhou, China
  • fYear
    2014
  • fDate
    9-11 June 2014
  • Firstpage
    1682
  • Lastpage
    1687
  • Abstract
    A method was proposed to analyze silicon condenser microphone using a perforated diaphragm. Different from the microphone with back-holes, the acoustic holes are made on the diaphragm, which avoids making the holes on the back plate and etching the back chamber. For the microphone with this structure, a new analysis method was proposed, which combines the microphone equivalent circuit and finite element analysis, establish a more accurate microphone equivalent circuit. On this basis, we studied the effects of diaphragm area, microphone acoustic hole and air gap on the microphone performance, which can provide the theoretical guidance for the design of microphone. Finally, the steepest descent is used to optimize the structure of the microphone. The sensitivity of the optimized structure is -41.6dB with the pull-in voltage is 12V, and the frequency response in 20Hz-20.6kHz is flat.
  • Keywords
    diaphragms; elemental semiconductors; equivalent circuits; finite element analysis; microphones; silicon; Si; acoustic holes; air gap; back-holes; equivalent circuit; finite element analysis; frequency response; micromachined silicon condenser microphone; perforated diaphragm; sensitivity; voltage 12 V; Acoustics; Equivalent circuits; Finite element analysis; Frequency response; Linear programming; Microphones; Sensitivity; equivalent circuit; finite-element; perforated diaphragm; silicon condenser microphone;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications (ICIEA), 2014 IEEE 9th Conference on
  • Conference_Location
    Hangzhou
  • Print_ISBN
    978-1-4799-4316-6
  • Type

    conf

  • DOI
    10.1109/ICIEA.2014.6931438
  • Filename
    6931438