DocumentCode
128691
Title
Simulation and optimization of a micro-machined silicon condenser microphone using a perforated diaphragm
Author
Duan Zhang ; Qi Fang ; Xiongxiong He
Author_Institution
Zhejiang Provincial Key Lab. for Signal Process., Zhejiang Univ. of Technol., Hangzhou, China
fYear
2014
fDate
9-11 June 2014
Firstpage
1682
Lastpage
1687
Abstract
A method was proposed to analyze silicon condenser microphone using a perforated diaphragm. Different from the microphone with back-holes, the acoustic holes are made on the diaphragm, which avoids making the holes on the back plate and etching the back chamber. For the microphone with this structure, a new analysis method was proposed, which combines the microphone equivalent circuit and finite element analysis, establish a more accurate microphone equivalent circuit. On this basis, we studied the effects of diaphragm area, microphone acoustic hole and air gap on the microphone performance, which can provide the theoretical guidance for the design of microphone. Finally, the steepest descent is used to optimize the structure of the microphone. The sensitivity of the optimized structure is -41.6dB with the pull-in voltage is 12V, and the frequency response in 20Hz-20.6kHz is flat.
Keywords
diaphragms; elemental semiconductors; equivalent circuits; finite element analysis; microphones; silicon; Si; acoustic holes; air gap; back-holes; equivalent circuit; finite element analysis; frequency response; micromachined silicon condenser microphone; perforated diaphragm; sensitivity; voltage 12 V; Acoustics; Equivalent circuits; Finite element analysis; Frequency response; Linear programming; Microphones; Sensitivity; equivalent circuit; finite-element; perforated diaphragm; silicon condenser microphone;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics and Applications (ICIEA), 2014 IEEE 9th Conference on
Conference_Location
Hangzhou
Print_ISBN
978-1-4799-4316-6
Type
conf
DOI
10.1109/ICIEA.2014.6931438
Filename
6931438
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