• DocumentCode
    1287827
  • Title

    The fabrication of silicon microsystems

  • Author

    Wood, D.

  • Volume
    11
  • Issue
    6
  • fYear
    1999
  • fDate
    12/1/1999 12:00:00 AM
  • Firstpage
    253
  • Lastpage
    260
  • Abstract
    The subject of silicon microsystems is reviewed from a device manufacturing viewpoint. Techniques taken straight from the integrated-circuit industry were the starting point for this work. Because of the 3D nature of microsystems, different processes have been developed to fully exploit the potential of this field, particularly in substrate etching and lithography. The paper explores the developments that have been made in this area, and how it is likely that microelectronics and microsystems, from a manufacturing point of view, will diverge even further in the future
  • Keywords
    elemental semiconductors; etching; integrated circuit manufacture; lithography; micromechanical devices; silicon; 3D microsystems; CMOS circuits; Si; device manufacture; integrated-circuit industry; lithography; microelectronics; silicon microsystems fabrication; substrate etching;
  • fLanguage
    English
  • Journal_Title
    Electronics & Communication Engineering Journal
  • Publisher
    iet
  • ISSN
    0954-0695
  • Type

    jour

  • DOI
    10.1049/ecej:19990602
  • Filename
    815892