DocumentCode
1287827
Title
The fabrication of silicon microsystems
Author
Wood, D.
Volume
11
Issue
6
fYear
1999
fDate
12/1/1999 12:00:00 AM
Firstpage
253
Lastpage
260
Abstract
The subject of silicon microsystems is reviewed from a device manufacturing viewpoint. Techniques taken straight from the integrated-circuit industry were the starting point for this work. Because of the 3D nature of microsystems, different processes have been developed to fully exploit the potential of this field, particularly in substrate etching and lithography. The paper explores the developments that have been made in this area, and how it is likely that microelectronics and microsystems, from a manufacturing point of view, will diverge even further in the future
Keywords
elemental semiconductors; etching; integrated circuit manufacture; lithography; micromechanical devices; silicon; 3D microsystems; CMOS circuits; Si; device manufacture; integrated-circuit industry; lithography; microelectronics; silicon microsystems fabrication; substrate etching;
fLanguage
English
Journal_Title
Electronics & Communication Engineering Journal
Publisher
iet
ISSN
0954-0695
Type
jour
DOI
10.1049/ecej:19990602
Filename
815892
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