Recent developments in micromachined silicon

Author

Moore, D.F. ; Syms, R.R.A.

Author_Institution

Dept. of Eng., Cambridge Univ., UK

Volume

11

Issue

6

fYear

1999

fDate

12/1/1999 12:00:00 AM

Firstpage

261

Lastpage

270

Abstract

This paper provides a review, directed at scientists and engineers concerned with microsystems technology, of advances in microelectromechanical systems (MEMS). The emphasis is on silicon technology, where the electrical properties of the material are exploited in circuitry and the mechanical properties are used in sensor and microstructure applications. Developments in surface micromachining are discussed, and applications in sensors, microelectronic devices, vacuum microanalysis systems, microfluidics, and optoelectronic subsystems are reviewed. Some emerging technologies are assessed and promising new research directions are identified

Keywords

chemical analysis; electric properties; elemental semiconductors; integrated circuit manufacture; integrated optoelectronics; mechanical properties; microfluidics; micromachining; micromechanical devices; monolithic integrated circuits; sensors; silicon; Si; electrical properties; mechanical properties; microelectromechanical systems; microelectronic devices; microfabrication technology; microfluidics; micromachined silicon; microsystems technology; optoelectronic subsystems; research; sensor applications; silicon technology; surface micromachining; thin-film deposition; vacuum microanalysis systems;

fLanguage

English

Journal_Title

Electronics & Communication Engineering Journal

Publisher

iet

ISSN

0954-0695

Type

jour

DOI

10.1049/ecej:19990603

Filename

815893