DocumentCode
1287840
Title
Mind the gap! Electronics and communications in the engineering continuum
Author
O´Reilly, John
Volume
11
Issue
6
fYear
1999
fDate
12/1/1999 12:00:00 AM
Firstpage
271
Lastpage
278
Abstract
Real-world problems do not respect the boundaries of engineering or established academic disciplines. This is illustrated by examples drawn from four broad research themes: the information society, sustainable development, transport studies and healthcare engineering. These unquestionably represent some of the major challenges of the day. The author argues that a holistic interdisciplinary approach, with electronics and communications playing a seminal role in the engineering continuum, has enabled real and substantive advances to be made, the total achievements being far more than the sum of the parts
Keywords
biomedical electronics; biomedical engineering; electronics industry; health care; information technology; prosthetics; telecommunication services; transportation; communications; electronic chip implants; electronics; global telecommunications; healthcare engineering; information society; research; sustainable development; transport studies;
fLanguage
English
Journal_Title
Electronics & Communication Engineering Journal
Publisher
iet
ISSN
0954-0695
Type
jour
DOI
10.1049/ecej:19990607
Filename
815894
Link To Document