Title :
80 Gbit/s ATM switch MCM based on multilayer ceramic technology
Author :
Okazaki, K. ; Sugiura, N. ; Harada, A. ; Yamanaka, N. ; Oki, E.
Author_Institution :
NTT Network Service Syst. Lab., Tokyo, Japan
fDate :
11/25/1999 12:00:00 AM
Abstract :
An 80 Gbit/s asynchronous transfer mode (ATM) switch multichip module (MCM) of dimensions 114×160×6.5 mm has been fabricated. This MCM can support high-density mounting and high-speed interconnection among large-scale-integrated (LSI) chips. Using LSI, ceramic-substrate, high-speed/high-power connector, and compact liquid-cooling technologies, an 80 Gbit/s ATM switching module has been built
Keywords :
asynchronous transfer mode; ceramic packaging; cooling; integrated circuit interconnections; multichip modules; 80 Gbit/s; ATM switch; LSI; MCM; high-density mounting; high-power connector; high-speed connector; high-speed interconnection; liquid-cooling technologies; multilayer ceramic technology;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19991410
