• DocumentCode
    128811
  • Title

    A novel duality-based modeling methodology for reverse current-voltage characteristics of SiC

  • Author

    Yamamoto, Takayuki ; Sawai, Tetsuro ; Mizutani, Keiichi ; Otsuka, N. ; Fujii, Eiji ; Horikawa, Nobuyuki ; Kanzawa, Yuchi

  • Author_Institution
    Device Solutions Center, Panasonic Corp., Kadoma, Japan
  • fYear
    2014
  • fDate
    9-11 Sept. 2014
  • Firstpage
    53
  • Lastpage
    56
  • Abstract
    This paper presents a novel methodology to design a compact but precise SPICE (Simulation Program with Integrated Circuit Emphasis) model which reproduces complete current-voltage (I-V) characteristics of Silicon Carbide (SiC) power devices. The methodology is based on duality relation between one function for the forward I-V characteristics and its inverse function for the reverse I-V characteristics. The simulated and the measured results of static characteristics of DioMOS (Diode integrated SiC MOSFET) have proved that the reverse I-V characteristics are reproduced by the inverse function of the forward I-V characteristics. Moreover, universal applicability of the proposed methodology is proved by other commercially supplied SiC power devices as well.
  • Keywords
    MOSFET; SPICE; duality (mathematics); silicon compounds; wide band gap semiconductors; DioMOS; SPICE model; SiC; SiC power devices; diode integrated SiC MOSFET; duality relation; forward I-V characteristics; inverse function; reverse I-V characteristics; reverse current-voltage characteristics; silicon carbide power devices; simulation program with integrated circuit emphasis model; Current measurement; Integrated circuit modeling; Logic gates; MOSFET; SPICE; Semiconductor device modeling; Silicon carbide; SPICE model; SiC MOSFET; body diode; channel diode; reverse currennt-voltage characteristics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
  • Conference_Location
    Yokohama
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4799-5287-8
  • Type

    conf

  • DOI
    10.1109/SISPAD.2014.6931561
  • Filename
    6931561