• DocumentCode
    128817
  • Title

    Advanced modeling of charge trapping: RTN, 1/f noise, SILC, and BTI

  • Author

    Goes, W. ; Waltl, M. ; Wimmer, Yannick ; Rzepa, G. ; Grasser, Tibor

  • Author_Institution
    Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
  • fYear
    2014
  • fDate
    9-11 Sept. 2014
  • Firstpage
    77
  • Lastpage
    80
  • Abstract
    In the course of years, several models have been put forward to explain noise phenomena, bias temperature instability (BTI), and gate leakage currents amongst other reliability issues. Mostly, these models have been developed independently and without considering that they may be caused by the same physical phenomenon. However, new experimental techniques have emerged, which are capable of studying these reliability issue on a microscopic level. One of them is the time-dependent defect spectroscopy (TDDS). Its intensive use has led to several interesting findings, including the fact that the recoverable component of BTI is due to reaction-limited processes. As a consequence, a quite detailed picture of the processes governing BTI has emerged. Interestingly, this picture has also been found to match the observations made for other reliability issues, such as random telegraph noise, 1/f noise, as well as gate leakage currents. Furthermore, the findings based on TDDS have lead to the development of capture/emission time (CET) maps, which can be used to understand the dynamic response of the defects given their widely distributed parameters.
  • Keywords
    1/f noise; electron traps; leakage currents; semiconductor device models; semiconductor device noise; semiconductor device reliability; 1/f noise; BTI; RTN; SILC; advanced modeling; bias temperature instability; capture-emission time; charge trapping; gate leakage currents; random telegraph noise; time-dependent defect spectroscopy; Charge carrier processes; Leakage currents; Logic gates; Noise; Reliability; Switches; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
  • Conference_Location
    Yokohama
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4799-5287-8
  • Type

    conf

  • DOI
    10.1109/SISPAD.2014.6931567
  • Filename
    6931567