DocumentCode
128817
Title
Advanced modeling of charge trapping: RTN, 1/f noise, SILC, and BTI
Author
Goes, W. ; Waltl, M. ; Wimmer, Yannick ; Rzepa, G. ; Grasser, Tibor
Author_Institution
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
fYear
2014
fDate
9-11 Sept. 2014
Firstpage
77
Lastpage
80
Abstract
In the course of years, several models have been put forward to explain noise phenomena, bias temperature instability (BTI), and gate leakage currents amongst other reliability issues. Mostly, these models have been developed independently and without considering that they may be caused by the same physical phenomenon. However, new experimental techniques have emerged, which are capable of studying these reliability issue on a microscopic level. One of them is the time-dependent defect spectroscopy (TDDS). Its intensive use has led to several interesting findings, including the fact that the recoverable component of BTI is due to reaction-limited processes. As a consequence, a quite detailed picture of the processes governing BTI has emerged. Interestingly, this picture has also been found to match the observations made for other reliability issues, such as random telegraph noise, 1/f noise, as well as gate leakage currents. Furthermore, the findings based on TDDS have lead to the development of capture/emission time (CET) maps, which can be used to understand the dynamic response of the defects given their widely distributed parameters.
Keywords
1/f noise; electron traps; leakage currents; semiconductor device models; semiconductor device noise; semiconductor device reliability; 1/f noise; BTI; RTN; SILC; advanced modeling; bias temperature instability; capture-emission time; charge trapping; gate leakage currents; random telegraph noise; time-dependent defect spectroscopy; Charge carrier processes; Leakage currents; Logic gates; Noise; Reliability; Switches; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
Conference_Location
Yokohama
ISSN
1946-1569
Print_ISBN
978-1-4799-5287-8
Type
conf
DOI
10.1109/SISPAD.2014.6931567
Filename
6931567
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