DocumentCode :
1288484
Title :
Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives
Author :
Ye, Lilei ; Lai, Zonghe ; Liu, Johan ; Tholen, A.
Author_Institution :
Dept. of Exp. Phys., Chalmers Univ. of Technol., Goteborg, Sweden
Volume :
22
Issue :
4
fYear :
1999
fDate :
10/1/1999 12:00:00 AM
Firstpage :
299
Lastpage :
302
Abstract :
The present work is to introduce nanoparticles in micro-sized metal particles to study particle distribution in polymer matrix. Previous examinations of the silver-filled particles reveal that the micro-sized particle fillers appear as full density silver flakes, while nanoparticle fillers appear as highly porous agglomerates, similar to open-cell foams. Actually little work has been carried out to study the cross-sectional area of a particle-particle-contact in isotropically conductive adhesives (ICA). In this study, transmission electron microscope is chosen as a main measure to analyze the distribution of different-sized particles. The percentage of the nanoparticles varies from 20 wt% and 50 wt% to full percentage within micro-sized particles, and the total metal content in epoxy resin is 70 wt%. So the change of contact area and contact behavior with various volume ratio of nano-sized and micro-sized particles was investigated. At the same time, the electrical resistivity was measured, which is compared with the different level of the filler loading
Keywords :
adhesives; conducting materials; electrical conductivity; filled polymers; nanostructured materials; particle size; silver; transmission electron microscopy; Ag; Ag particle size; electrical conductivity; epoxy resin; filled polymer; isotropically conductive adhesive; metal nanoparticle; transmission electron microscopy; Conductive adhesives; Conductivity; Contacts; Epoxy resins; Independent component analysis; Nanoparticles; Particle measurements; Polymers; Silver; Transmission electron microscopy;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/6104.816098
Filename :
816098
Link To Document :
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