Title :
Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology
Author :
Walker, Anthony ; Baldwin, Daniel F.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
10/1/1999 12:00:00 AM
Abstract :
Advances in electronics packaging and assembly technology are driving increased demand for ultra-fine pitch solder deposition. In this work, innovative solder deposition techniques based on laser printing are investigated for low-cost ultra-fine pitch printing applications. This paper investigates the feasibility of using solder particles in off-the-shelf xerographic technology. The physics of two development systems (dual component and monocomponent) is discussed. This inquisition leads to a discussion of triboelectric charging of the solder toners, coating the solder with thin dielectrics, and charge induction by an applied electric field. This initial investigation explores the basic feasibility of xerographic printing techniques using solder and defines future work
Keywords :
assembling; electrophotography; fine-pitch technology; laser deposition; microassembling; printed circuit manufacture; reflow soldering; surface mount technology; triboelectricity; SMT production line; applied electric field; charge induction; dual component system; electronics assembly; electronics packaging; laser printing technology; low-cost solder printing process; monocomponent system; off-the-shelf xerographic technology; solder deposition techniques; solder particles; solder toners; thin dielectric coating; triboelectric charging; ultra-fine pitch solder printing process; xerographic printing techniques; Assembly; Coatings; Costs; Dielectrics; Electronics packaging; Flip chip; Laser theory; Manufacturing; Physics; Printing;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/6104.816099
