DocumentCode :
1288623
Title :
A 18 GHz Broadband Stacked FET Power Amplifier Using 130 nm Metamorphic HEMTs
Author :
Lee, Choonghee ; Kim, Youngmin ; Koh, Yumin ; Kim, Jihoon ; Seo, Kwangseok ; Jeong, Jinho ; Kwon, Youngwoo
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
Volume :
19
Issue :
12
fYear :
2009
Firstpage :
828
Lastpage :
830
Abstract :
A broadband power amplifier (PA) with a 3 dB power bandwidth of 72% is presented using metamorphic high electron mobility transistors (mHEMTs). A stacked FET structure, where transistors are series connected to combine voltage swings, is employed to overcome relatively low breakdown voltages of mHEMTs. Series-connected PA´s show much higher load impedance compared to the parallel combined transistors, which allows output matching to be realized in the low quality (Q)-factor region, providing the broadband performance. The fabricated PA using quadruple-stacked 130 nm mHEMTs has a gain of 21.2 dB and saturated output power of 26.4 dBm with power added efficiency (PAE) of 33% at the design frequency of 18 GHz. The 3 dB output power bandwidth is from 10 to 23 GHz.
Keywords :
microwave field effect transistors; microwave power amplifiers; power HEMT; semiconductor device breakdown; FET; HEMT; Q-factor; bandwidth 10 GHz to 23 GHz; breakdown voltages; broadband power amplifier; frequency 18 GHz; gain 21.2 dB; load impedance; metamorphic high electron mobility transistors; power added efficiency; size 130 nm; voltage swings; Bandwidth; Breakdown voltage; Broadband amplifiers; FETs; HEMTs; High power amplifiers; MODFETs; Power amplifiers; Power generation; mHEMTs; Metamorphic high electron mobility transistor (mHEMT); power amplifier (PA); stacked field effect transistor (FET);
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2009.2033533
Filename :
5320184
Link To Document :
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