Parameters Variability Effects on Multiconductor Interconnects via Hermite Polynomial Chaos

This paper focuses on the derivation of an enhanced transmission-line model allowing the stochastic analysis of a realistic multiconductor interconnect. The proposed model, which is based on the expansion of the well-known telegraph equations in terms of orthogonal polynomials, includes the variability of geometrical or material properties of the interconnect due to uncertainties like fabrication process or temperature. A real application example involving the frequency-domain analysis of a coupled microstrip and the computation of the parameters variability effects on the transmission-line response concludes this paper.