DocumentCode
1289309
Title
Technical progress of EMI shielding materials in Japan
Author
Yasufuku, Sachio
Author_Institution
Dept. of Electr. Eng., Tokyo Denki Univ., Japan
Volume
6
Issue
6
fYear
1990
Firstpage
21
Lastpage
30
Abstract
Increased usage of thermoplastic materials in electronic apparatus has accentuated electromagnetic interference (EMI) problems. Methods for providing shielding by metallizing the thermoplastics using electroconductive paints and electroconductive thermoplastic molding compounds are examined, following a review of the fundamentals of electromagnetic wave shielding. The characteristics of the commonly used paints and compounds, as well as those of some miscellaneous materials, are discussed. The status of EMI shielding materials in Japan is described.<>
Keywords
electromagnetic interference; protective coatings; shielding; EMI shielding materials; Japan; electroconductive paints; electroconductive thermoplastic molding compounds; electromagnetic interference; electromagnetic wave shielding; metallic surface coatings; Conducting materials; Councils; Electromagnetic interference; Electromagnetic scattering; Inorganic materials; Paints; Plastics; Protection; Spraying; Vacuum technology;
fLanguage
English
Journal_Title
Electrical Insulation Magazine, IEEE
Publisher
ieee
ISSN
0883-7554
Type
jour
DOI
10.1109/57.63095
Filename
63095
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