DocumentCode
129017
Title
Trade-offs in execution signature compression for reliable processor systems
Author
Caplan, Jonah ; Mera, Maria Isabel ; Milder, Peter ; Meyer, Brett H.
Author_Institution
Electr. & Comput. Eng., McGill Univ., Montreal, QC, Canada
fYear
2014
fDate
24-28 March 2014
Firstpage
1
Lastpage
6
Abstract
As semiconductor processes scale, making transistors more vulnerable to transient upset, a wide variety of microarchitectural and system-level strategies are emerging to perform efficient error detection and correction computer systems. While these approaches often target various application domains and address error detection and correction at different granularities and with different overheads, an emerging trend is the use of state compression, e.g., cyclic redundancy check (CRC), to reduce the cost of redundancy checking. Prior work in the literature has shown that Fletcher´s checksum (FC), while less effective where error detection probability is concerned, is less computationally complex when implemented in software than the more-effective CRC. In this paper, we reexamine the suitability of CRC and FC as compression algorithms when implemented in hardware for embedded safety-critical systems. We have developed and evaluated parameterizable implementations of CRC and FC in FPGA, and we observe that what was true for software implementations does not hold in hardware: CRC is more efficient than FC across a wide variety of target input bandwidths and compression strengths.
Keywords
cyclic redundancy check codes; error correction codes; error detection codes; field programmable gate arrays; integrated circuit reliability; microprocessor chips; radiation hardening (electronics); transistor circuits; FPGA; Fletcher´s checksum; computationally complex; cyclic redundancy check; embedded safety-critical systems; error correction computer systems; error detection computer systems; error detection probability; execution signature compression; microarchitectural strategies; processor systems; redundancy checking; semiconductor processes scale; state compression; system-level strategies; transient upset; transistors; Clocks; Hardware; Pipeline processing; Polynomials; Redundancy; Registers; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
Conference_Location
Dresden
Type
conf
DOI
10.7873/DATE.2014.106
Filename
6800307
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