• DocumentCode
    1290659
  • Title

    A-RAM Memory Cell: Concept and Operation

  • Author

    Rodriguez, Noel ; Gamiz, Francisco ; Cristoloveanu, Sorin

  • Author_Institution
    Dept. of Electron., Univ. de Granada, Granada, Spain
  • Volume
    31
  • Issue
    9
  • fYear
    2010
  • Firstpage
    972
  • Lastpage
    974
  • Abstract
    Capacitorless single-transistor (1T) DRAM cells are envisioned for replacing the conventional DRAMs where the storage capacitor can hardly be further miniaturized. We propose a totally different 1T-DRAM cell, named A-RAM, which is compatible with SOI CMOS deep scaling. Its novelty comes from the partitioning of the transistor body into two distinct ultrathin regions separated by a thin dielectric. The holes are physically confined in the upper semibody and govern the electron current flowing into the lower semibody. The systematic simulations show that the A-RAM is attractive for low-power and embedded memory applications since it exhibits enhanced state definition, retention, scalability, and simple waveforms for word and bit lines.
  • Keywords
    DRAM chips; silicon-on-insulator; A-RAM memory cell; SOI CMOS deep scaling; capacitorless single-transistor DRAM cell; electron current flowing; storage capacitor; systematic simulation; thin dielectric; Capacitance; Capacitors; Charge carrier processes; Computer architecture; Dielectrics; Lead compounds; Logic gates; MOSFETs; Microprocessors; Random access memory; Scalability; Silicon on insulator technology; Transistors; Voltage control; A-RAM; capacitorless; floating body; scaling; silicon on insulator (SOI); single-transistor DRAM (1T-DRAM); supercoupling; volatile memory;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2010.2055531
  • Filename
    5545354