• DocumentCode
    1290702
  • Title

    Improved heat sinking for laser-diode arrays using microchannels in CVD diamond

  • Author

    Goodson, Kenneth E. ; Kurabayashi, Katsuo ; Pease, R.Fabian W.

  • Author_Institution
    Stanford Univ., CA, USA
  • Volume
    20
  • Issue
    1
  • fYear
    1997
  • fDate
    2/1/1997 12:00:00 AM
  • Firstpage
    104
  • Lastpage
    109
  • Abstract
    This work proposes a novel cooling system for high-power laser-diode arrays, for which the maximum optical output power density per unit surface area is limited by the temperature rise due to self-heating. The proposed system uses a microchannel heat sink made of chemical-vapor-deposited (CVD) diamond, whose high thermal conductivity increases the efficiency of the channel-wall fins and reduces the array-to-coolant thermal resistance using a simple model for the combined conduction and convection problem. The resistance is calculated to be 75% less than that for a conventional configuration using a silicon microchannel heat sink. The present analysis strongly motivates a future experimental study
  • Keywords
    chemical vapour deposition; cooling; diamond; heat sinks; semiconductor device packaging; semiconductor laser arrays; thermal conductivity; thermal resistance; C; CVD; array-to-coolant thermal resistance; channel-wall fins; combined conduction/convection problem; cooling system; heat sinking; laser-diode arrays; microchannels; optical output power density; self-heating; temperature rise; thermal conductivity; Chemical lasers; Cooling; Heat sinks; Microchannel; Optical arrays; Power generation; Power lasers; Resistance heating; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.554536
  • Filename
    554536