DocumentCode :
1290860
Title :
Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250
and 400
. The silver migration was found in the samples tested at 400°C, 350°C, 300°C, and 250°C. The measurements on the leakage current versus time were characterized by an initial incubation period, called “lifetime,” followed by a sharp rise as the silver dendrites were shorting the electrodes. A simple phenomenological model was derived to account for the observed dependence of lifetime on the electric field and temperature. The EDS mappings revealed the significant presence of oxygen on the positive electrode but the complete absence on the negative electrode. A mechanism involving the oxidation of silver and the dissociation of silver oxide at the anode was suggested. We suggest that the migration of a sintered nanosilver die attachment can be prevented in high-temperature applications through packaging or encapsulation to reduce the partial pressure of oxygen.</div>
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<div class='leftDiv labelDiv col-xs-4 col-sm-2 fullRecLabelEnglish'>Keywords : </div><div class='valueDiv leftDirection leftAlign col-xs-8 col-sm-10 fullRecValueEnglish'>X-ray chemical analysis; joining processes; leakage currents; microassembling; nanostructured materials; optical microscopy; power electronics; scanning electron microscopy; sintering; Ag; Al<sub>2</sub>O<sub>3</sub>; EDS; EDS mappings; alternative lead-free solution; alumina substrate; dendrites; dry air; electrode gap; energy dispersive spectroscopy; high-temperature environment; leakage currents; low-temperature joining; nanosilver die-attach material; optical microscopy; phenomenological model; power electronics devices; scanning electron microscopy; semiconductor chips; silver migration; sintering; temperature 250 degC to 400 degC; Current measurement; Electrodes; Leakage current; Nanostructured materials; Optical microscopy; Scanning electron microscopy; Semiconductor materials; Silver; Substrates; Temperature; High-temperature packaging; low-temperature sintering of nanosilver paste; silver migration; sintered die attach;</div>
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<div class='leftDiv labelDiv col-xs-4 col-sm-2 fullRecLabelEnglish'>fLanguage : </div><div class='valueDiv leftDirection leftAlign col-xs-8 col-sm-10 fullRecValueEnglish'>English</div>
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<div class='leftDiv labelDiv col-xs-4 col-sm-2 fullRecLabelEnglish'>Journal_Title : </div><div class='valueDiv leftDirection leftAlign col-xs-8 col-sm-10 fullRecValueEnglish'>Device and Materials Reliability, IEEE Transactions on</div>
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<div class='leftDiv labelDiv col-xs-4 col-sm-2 fullRecLabelEnglish'>Publisher : </div><div class='valueDiv leftDirection leftAlign col-xs-8 col-sm-10 fullRecValueEnglish'>ieee</div>
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<div class='leftDiv labelDiv col-xs-4 col-sm-2 fullRecLabelEnglish'>ISSN : </div><div class='valueDiv leftDirection leftAlign col-xs-8 col-sm-10 fullRecValueEnglish'>1530-4388</div>
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<div class='leftDiv labelDiv col-xs-4 col-sm-2 fullRecLabelEnglish'>Type : </div><div class='valueDiv leftDirection leftAlign col-xs-8 col-sm-10 fullRecValueEnglish'>jour</div>
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<div class='leftDiv labelDiv col-xs-4 col-sm-2 fullRecLabelEnglish'>DOI : </div><div class='valueDiv leftDirection leftAlign col-xs-8 col-sm-10 fullRecValueEnglish'>10.1109/TDMR.2010.2064775</div>
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<div class='leftDiv labelDiv col-xs-4 col-sm-2 fullRecLabelEnglish'>Filename : </div><div class='valueDiv leftDirection leftAlign col-xs-8 col-sm-10 fullRecValueEnglish'>5545383</div>
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<div class='leftDiv labelDiv col-xs-4 col-sm-2 fullRecLabelEnglish'>Link To Document : </div><div class='valueDiv leftDirection leftAlign fullRecValueEnglish col-xs-8 col-sm-10'><a href='https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1290860' target='_blank'>https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1290860</a></div>
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