3D-Antenna-in-Package Solution for Microwave Wireless Sensor Network Nodes

Author

Enayati, Amin ; Brebels, Steven ; De Raedt, Walter ; Vandenbosch, Guy A E

Author_Institution

Electr. Eng. Dept. (ESAT), Katholieke Univ. Leuven, Leuven, Belgium

Volume

59

Issue

10

fYear

2011

Firstpage

3617

Lastpage

3623

Abstract

A three-dimensional packaging solution is introduced for wireless sensor network nodes at microwave frequencies. The package has a cubic geometry with radiating antennas on its surrounding faces. The cube which is called e-CUBE is designed in such a way that its radiation pattern resembles that of a simple dipole. The antenna is designed in a modular way and the final structure has a return loss better than 10 dB and a dipole-shape pattern at 17.2 GHz. Moreover, the measurement and simulation results show very good agreement.

Keywords

antenna radiation patterns; dipole antennas; microwave antennas; system-in-package; three-dimensional integrated circuits; wireless sensor networks; 3D antenna-in-package solution; antenna radiation pattern; dipole antenna; e-CUBE design; microwave wireless sensor network node; three-dimensional packaging solution; Antenna arrays; Antenna radiation patterns; Arrays; Dipole antennas; Microstrip; Three dimensional displays; Wireless sensor networks; Dipole antenna; RF and microwave packaging; three-dimensional packaging; wireless sensor networks;

fLanguage

English

Journal_Title

Antennas and Propagation, IEEE Transactions on

Publisher

ieee

ISSN

0018-926X

Type

jour

DOI

10.1109/TAP.2011.2163779

Filename

5976383