Title :
3D-Antenna-in-Package Solution for Microwave Wireless Sensor Network Nodes
Author :
Enayati, Amin ; Brebels, Steven ; De Raedt, Walter ; Vandenbosch, Guy A E
Author_Institution :
Electr. Eng. Dept. (ESAT), Katholieke Univ. Leuven, Leuven, Belgium
Abstract :
A three-dimensional packaging solution is introduced for wireless sensor network nodes at microwave frequencies. The package has a cubic geometry with radiating antennas on its surrounding faces. The cube which is called e-CUBE is designed in such a way that its radiation pattern resembles that of a simple dipole. The antenna is designed in a modular way and the final structure has a return loss better than 10 dB and a dipole-shape pattern at 17.2 GHz. Moreover, the measurement and simulation results show very good agreement.
Keywords :
antenna radiation patterns; dipole antennas; microwave antennas; system-in-package; three-dimensional integrated circuits; wireless sensor networks; 3D antenna-in-package solution; antenna radiation pattern; dipole antenna; e-CUBE design; microwave wireless sensor network node; three-dimensional packaging solution; Antenna arrays; Antenna radiation patterns; Arrays; Dipole antennas; Microstrip; Three dimensional displays; Wireless sensor networks; Dipole antenna; RF and microwave packaging; three-dimensional packaging; wireless sensor networks;
Journal_Title :
Antennas and Propagation, IEEE Transactions on
DOI :
10.1109/TAP.2011.2163779
