New formulas of interconnect capacitances based on results of conformal mapping method

Author

Stellari, Franco ; Lacaita, Andrea L.

Author_Institution

Dipt. di Elettronica e Inf., Politecnico di Milano, Italy

Volume

47

Issue

1

fYear

2000

fDate

1/1/2000 12:00:00 AM

Firstpage

222

Lastpage

231

Abstract

The work presents new formulas for the capacitances of the most common two-dimensional (2-D) interconnect structures. The results have been obtained by using a physically-based approach: each geometry has been divided into elementary components studied rigorously with the conformal mapping method. The capacitances of structures composed by one, two, or three lines on a ground plane are then written as a weighted sum of such elements. Since the elementary terms already account for the correct geometrical dependencies, very few numerical simulations have been required to tailor the formulas, attaining an accuracy higher than previously known results, over a wide range of the geometrical parameters of the lines

Keywords

VLSI; capacitance; delays; integrated circuit design; integrated circuit interconnections; microstrip lines; 2D interconnect capacitances; conformal mapping method; geometrical dependencies; ground plane; physically-based approach; weighted sum; Capacitance; Conformal mapping; Delay; Dielectric constant; Geometry; Integrated circuit interconnections; Microstrip; Numerical simulation; Two dimensional displays; Very large scale integration;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/16.817589

Filename

817589