A low-cost radiation hardened flip-flop

The aggressive scaling of semiconductor devices has caused a significant increase in the soft error rate caused by radiation hits. This has led to an increasing need for fault-tolerant techniques to maintain system reliability. Conventional radiation hardening techniques, typically used in safety-critical applications, are prohibitively expensive for non-safety-critical electronics. This work proposes a novel flip-flop architecture named SETTOFF which significantly improves circuit resilience to radiation hits over previous techniques. In addition, compared to other techniques such as a TMR latch, SETTOFF reduces the area and performance overheads by up to 50% and 80%, respectively; the power consumption overhead is also reduced by up to 85%. In addition, a novel reliability metric called radiation-induced failure rate is developed which can be a valuable tool to predict the impact of radiation hits and quantitatively compare the reliability of various radiation hardened techniques. Our analysis shows that the proposed technique can achieve zero SEU failure rate, and significantly reduce the SET failure rate.