DocumentCode :
129188
Title :
Temperature distribution of piezoelectric transformer with heat couple component using finite element method
Author :
Weiwei Shao ; Zhile Han ; Yongjia Xiang ; Peiyang Li ; Yaoyao Cui
Author_Institution :
Dept. of Med. Ultrasound, Suzhou Inst. of Biomed. Eng. & Technol., Suzhou, China
fYear :
2014
fDate :
3-6 Sept. 2014
Firstpage :
1340
Lastpage :
1343
Abstract :
The temperature field of a piezoelectric transformer with heat couple component are analyzed at steady state conditions in this paper. The contour extensional vibration mode of the transformer is determined by impedance simulation analysis and experiment result. Mechanical vibration losses, piezoelectric losses, dielectric losses are considered for a piezoelectric transformer. In order to verify the calculated temperature results, the piezoelectric transformer ´s temperature distributions were measured by the infrared thermometry. The experiment results show a good uniformity with the calculation results. For the piezoelectric transformer with heat couple component, friction heat were considered as another heat source of temperature distribution. The temperature distribution results show the heat couple component depresses temperature gradient of the piezoelectric transformer and improves piezoelectric material utilization rate effectively.
Keywords :
dielectric losses; finite element analysis; piezoelectric devices; temperature distribution; temperature measurement; transformers; vibrations; contour extensional vibration mode; dielectric losses; finite element method; friction heat; heat couple component; impedance simulation analysis; infrared thermometry; mechanical vibration losses; piezoelectric losses; piezoelectric material utilization rate; piezoelectric transformer; temperature distribution; temperature gradient; Couplings; Dielectric losses; Heating; Temperature measurement; Piezoelectric transformer; finite element simulation; heat couple component; temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/ULTSYM.2014.0331
Filename :
6931832
Link To Document :
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