• DocumentCode
    129201
  • Title

    A single-chip biosensing platform integrating FBAR sensor with digital microfluidic device

  • Author

    Menglun Zhang ; Weiwei Cui ; Ji Liang ; Daihua Zhang ; Wei Pang ; Hao Zhang

  • Author_Institution
    State Key Lab. of Precision Meas. Technol. & Instrum., Tianjin Univ., Tianjin, China
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    1521
  • Lastpage
    1523
  • Abstract
    Although digital microfluidic system has shown great potential in a wide range of applications, a single-chip platform integrating biochemical sensors with digital microfluidic devices is still lacking. In this paper, film bulk acoustic resonator (FBAR) sensors and electrowetting-on-dielectric (EWOD) actuator are integrated on a single silicon chip, where the EWOD actuator manipulates digital droplets and the FBAR sensor detects analyte in the droplets. Thin aluminum nitride (AlN) film is a critical material as both the FBAR piezoelectric layer and the EWOD dielectric layer, which facilitates the compact integration of the two devices on a chip. A preliminary demonstration of Hg2+ droplet transportation and detection is conducted on the platform. The integrated platform is expected to play an important role in many complex lab-on-a-chip applications in chemistry, biology and medicine.
  • Keywords
    III-V semiconductors; acoustic resonators; acoustic transducers; aluminium compounds; bioMEMS; biosensors; chemical sensors; lab-on-a-chip; mercury (metal); microfluidics; microsensors; piezoelectric actuators; semiconductor thin films; wide band gap semiconductors; AlN; EWOD dielectric layer; FBAR piezoelectric layer; FBAR sensor; Hg; biochemical sensors; biology; chemistry; digital droplets; digital microfluidic device; droplet transportation; electrowetting-ondielectric actuator; film bulk acoustic resonator; lab-on-achip applications; medicine; single-chip biosensing platform; thin aluminum nitride film; Acoustics; Gold; Silicon; EWOD; FBAR sensor; integration; lab-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0376
  • Filename
    6931839