Title :
On yield-optimizing design rules
Author :
Heavlin, William D. ; Beck, Clark
Author_Institution :
Enhansys Inc., Cupertino, CA, USA
fDate :
3/1/1985 12:00:00 AM
Abstract :
Integrated circuit design rules represent a trade-off between the probability that a given die will yield and the physical size of that die. Optimum design rules maximize the average number of good dice on a wafer. The authors present a methodology for calculating design rules that are optimum in this sense. The development involves four points: (1) any design rule can be represented physically by a key-and-target structure; (2) such key-and-target structures lend themselves to suitable mathematical analysis; (3) the average yield of a given ensemble of design rules may be estimated by computer simulation and (4) the most efficient design rules may be estimated by the methods of stochastic optimization.
Keywords :
integrated circuit technology; optimisation; probability; stochastic processes; IC technology; die size; key/target structure; physical size; probability; stochastic optimization; yield-optimizing design rules; Equations; Fabrication; Integrated circuits; Layout; Lithography; Mathematical model;
Journal_Title :
Circuits and Devices Magazine, IEEE
DOI :
10.1109/MCD.1985.6311943