Title :
Circuitry in three dimensions: multifunctional molded plastic packages
Author :
Frisch, David C.
Author_Institution :
Mitsui-Pathtek Corp., Rochester, NY, USA
Abstract :
The topics dealt with are: some of the major structural/mechanical benefits of a molded circuit board; some of the material benefits of a molded circuit board; high-heat thermoplastics; resin materials for molded circuit interconnect fabrication; MCB metallization; MCB general properties; molded circuit interconnect applications; and the future of performance plastics and 3D molded circuit interconnects. Molded circuits consolidate circuitry, wiring and hardware into a one piece construction. The resultant integral assembly provides increased reliability and reduced costs. Elements of cost savings include reduced factory labor, parts consolidations, simplified product assembly, lighter weight, compact size, and unique function
Keywords :
packaging; plastics; polymers; printed circuits; wiring; 3D; circuit interconnect fabrication; costs; integral assembly; material; metallization; molded circuit board; packages; performance; reliability; resin; thermoplastics; wiring; Assembly; Fabrication; Inorganic materials; Integrated circuit interconnections; Mechanical factors; Metallization; Plastics; Printed circuits; Resins; Wiring;
Journal_Title :
Industry Applications, IEEE Transactions on
