• DocumentCode
    129237
  • Title

    Row-column addressed 2-D CMUT arrays with integrated apodization

  • Author

    Christiansen, Thomas Lehrmann ; Rasmussen, Morten Fischer ; Jensen, John A. ; Thomsen, Erik V.

  • Author_Institution
    Dept. of Micro- & Nanotechnol., Tech. Univ. of Denmark, Lyngby, Denmark
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    600
  • Lastpage
    603
  • Abstract
    Experimental results from row-column addressed capacitive micromachined ultrasonic transducers (CMUTs) with integrated apodization are presented. The apodization is applied by varying the density of CMUT cells in the array with the objective of damping the edge waves originating from the element ends. Two row-column addressed 32+32 CMUT arrays are produced using a wafer-bonding technique, one with and one without integrated apodization. Hydrophone measurements of the emitted pressure field from the array with integrated apodization show a reduction in edge wave energy of 8.4 dB (85 %) compared to the array without integrated apodization. Field II simulations yield a corresponding reduction of 13.0 dB (95 %). The simulations are able to replicate the measured pressure field, proving the predictability of the technique.
  • Keywords
    acoustic arrays; acoustic emission; acoustic imaging; damping; hydrophones; ultrasonic transducers; wafer bonding; CMUT cell density; damping; edge wave energy; edge waves; emitted pressure field; field II simulations; hydrophone measurements; integrated apodization; row-column addressed 2D CMUT arrays; row-column addressed capacitive micromachined ultrasonic transducers; wafer-bonding technique; Electrodes; Image edge detection; Imaging; Pressure measurement; Sonar equipment; Transducers; Ultrasonic imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0147
  • Filename
    6931859