DocumentCode
129391
Title
Complete bandgap SAW phononic resonant topologies
Author
Yantchev, Ventsislav
Author_Institution
SmartCom Bulgaria, Sofia, Bulgaria
fYear
2014
fDate
3-6 Sept. 2014
Firstpage
475
Lastpage
478
Abstract
Resonant surface acoustic wave (SAW) structures employing 2D phononic gratings with hexagonal symmetry are micro-fabricated and tested in a proof of principle study. The proposed structures have the advantage of being compatible with the planar SAW technology, while ensuring operation within the complete frequency bandgap of the phononic grating. More specifically, 2D phononic gratings exhibiting a complete frequency bandgap are employed in the design of three distinct types of resonant test structures. The proposed test structures are fabricated on to a 128° YX LiNbO3 substrate by means of low resolution photolithography. Frequency response measurements of the SAW phononic resonators confirmed operation within the complete frequency bandgap of each grating structure. The experimental results obtained demonstrate that surface phononic gratings can be successfully used in the design of SAW resonators. The proposed research paves the way for subsequent implementation of the phononic bandgap technology in high performance micro-acoustic RF components.
Keywords
microfabrication; phononic crystals; photolithography; surface acoustic wave resonators; surface acoustic waves; 2D phononic gratings; LiNbO3; SAW phononic bandgap; SAW phononic resonant topology; SAW phononic resonators; SAW resonator design; complete frequency bandgap; frequency response measurements; grating structure; hexagonal symmetry; low resolution photolithography; microacoustic RF components; microfabrication; phononic bandgap technology; planar SAW technology; resonant surface acoustic wave structures; resonant test structures; surface phononic gratings; Gratings; Photonic band gap; Resonant frequency; Strips; Surface acoustic waves; Transducers; Grating; Phononic; RF; Resonator; SAW;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location
Chicago, IL
Type
conf
DOI
10.1109/ULTSYM.2014.0118
Filename
6931935
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