• DocumentCode
    1294010
  • Title

    Enhanced total ionizing dose tolerance of bulk CMOS transistors fabricated for ultra-low power applications

  • Author

    Xapsos, M.A. ; Summers, G.P. ; Jackson, E.M.

  • Author_Institution
    Naval Res. Lab., Washington, DC, USA
  • Volume
    46
  • Issue
    6
  • fYear
    1999
  • Firstpage
    1697
  • Lastpage
    1701
  • Abstract
    The first radiation tests of transistors fabricated in a commercial bulk CMOS process designed for ultra-low power applications in space are presented and analyzed. The predominant failure mode of bulk CMOS, i.e., radiation-induced parasitic leakage currents in n-channel transistors, is greatly suppressed by the use of low threshold voltage devices and by the application of backbias used to optimize their performance. With 2 volts of backbias applied, the transistors tested here show no degradation up to a dose of 200 krad(Si).
  • Keywords
    CMOS integrated circuits; MOSFET; failure analysis; integrated circuit reliability; integrated circuit testing; leakage currents; radiation hardening (electronics); semiconductor device reliability; semiconductor device testing; 2 V; 200 krad; backbias; bulk CMOS transistors; commercial bulk CMOS process; enhanced total ionizing dose tolerance; failure mode; low threshold voltage devices; n-channel transistors; radiation tests; radiation-induced parasitic leakage currents; ultra-low power applications; CMOS process; CMOS technology; Circuits; Leakage current; Microelectronics; Orbits; Power dissipation; Space technology; Testing; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.819141
  • Filename
    819141