DocumentCode
1294010
Title
Enhanced total ionizing dose tolerance of bulk CMOS transistors fabricated for ultra-low power applications
Author
Xapsos, M.A. ; Summers, G.P. ; Jackson, E.M.
Author_Institution
Naval Res. Lab., Washington, DC, USA
Volume
46
Issue
6
fYear
1999
Firstpage
1697
Lastpage
1701
Abstract
The first radiation tests of transistors fabricated in a commercial bulk CMOS process designed for ultra-low power applications in space are presented and analyzed. The predominant failure mode of bulk CMOS, i.e., radiation-induced parasitic leakage currents in n-channel transistors, is greatly suppressed by the use of low threshold voltage devices and by the application of backbias used to optimize their performance. With 2 volts of backbias applied, the transistors tested here show no degradation up to a dose of 200 krad(Si).
Keywords
CMOS integrated circuits; MOSFET; failure analysis; integrated circuit reliability; integrated circuit testing; leakage currents; radiation hardening (electronics); semiconductor device reliability; semiconductor device testing; 2 V; 200 krad; backbias; bulk CMOS transistors; commercial bulk CMOS process; enhanced total ionizing dose tolerance; failure mode; low threshold voltage devices; n-channel transistors; radiation tests; radiation-induced parasitic leakage currents; ultra-low power applications; CMOS process; CMOS technology; Circuits; Leakage current; Microelectronics; Orbits; Power dissipation; Space technology; Testing; Threshold voltage;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/23.819141
Filename
819141
Link To Document