DocumentCode
129403
Title
Cross-correlation of specification and RTL for soft IP analysis
Author
Singh, Bawa ; Shankar, Ashwin ; Wolff, Francis ; Papachristou, C. ; Weyer, Daniel ; Clay, Steve
Author_Institution
Dept. of EECS, Case Western Reserve Univ., Cleveland, OH, USA
fYear
2014
fDate
24-28 March 2014
Firstpage
1
Lastpage
6
Abstract
Semiconductor companies often use 3rd party IPs in order to improve their design productivity. In practice, there are risks involved in using a 3rd party IP as bugs may creep in due to versioning issues, poor documentation, and mismatches between specification and RTL. As a result of this, 3rd party IP specification and RTL must be carefully evaluated. Our methodology addresses this issue, which cross-correlates specification and RTL to discover these discrepancies. The key innovative ideas in our approach are to use prior and trusted experience about designs, which include their specs and RTL code. Also, we have captured this trusted experience into two knowledge bases (KB), Spec-KB and RTL-KB. Finally, knowledge base rules are used to cross-correlate the RTL blocks to the specs. We have tested our approach by analyzing several 3rd party IPs. We have defined metrics for specification coverage and RTL identification coverage to quantify our results.
Keywords
formal specification; industrial property; integrated circuit design; system-on-chip; 3rd party IP specification; RTL code; RTL identification coverage; RTL-KB; SoC designs; knowledge base rules; semiconductor companies; soft IP analysis; spec-KB; specification cross-correlation; system on chip designs; IP networks; Knowledge based systems; Ontologies; Registers; Standards; System-on-chip; Vectors;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
Conference_Location
Dresden
Type
conf
DOI
10.7873/DATE.2014.303
Filename
6800504
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