• DocumentCode
    1294407
  • Title

    Contactless measurement of conductivity of metals and semiconductors and of plating thickness of sheet conductors

  • Author

    Olszewski, E.J. ; Cormack, G.D.

  • Author_Institution
    Carleton Univ., Ottawa, Ont., Canada
  • Issue
    3
  • fYear
    1976
  • Firstpage
    186
  • Lastpage
    190
  • Abstract
    Theory is developed and experimental data is presented for a noncontacting, nondestructive transient eddy current testing technique that can be used for conductivity measurements on flat surface samples over a range of at least 300<;σ<;6×107 mho/m. Furthermore, this technique is shown to be useable for measurement of the thickness of plating of electrically conductive material over the range of at least 0.1 μm<;x<;50 μm. The method is based on pulse excitation of a small coil above the sample. The pulser and display unit is a commercially available time-domain reflectometer.
  • Keywords
    eddy currents; electrical conductivity measurement; 300 to 6 x 107 mho/m; conductive plating thickness measurement; conductivity measurements; flat surface samples; metals; noncontacting measurement; nondestructive transient eddy current testing technique; plating thickness range 0.1 to 50 micron; semiconductors; time domain reflectometer; Coils; Conductivity; Impedance; Semiconductor device measurement; Substrates; Thickness measurement;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.1976.6312343
  • Filename
    6312343