DocumentCode
1294407
Title
Contactless measurement of conductivity of metals and semiconductors and of plating thickness of sheet conductors
Author
Olszewski, E.J. ; Cormack, G.D.
Author_Institution
Carleton Univ., Ottawa, Ont., Canada
Issue
3
fYear
1976
Firstpage
186
Lastpage
190
Abstract
Theory is developed and experimental data is presented for a noncontacting, nondestructive transient eddy current testing technique that can be used for conductivity measurements on flat surface samples over a range of at least 300<;σ<;6×107 mho/m. Furthermore, this technique is shown to be useable for measurement of the thickness of plating of electrically conductive material over the range of at least 0.1 μm<;x<;50 μm. The method is based on pulse excitation of a small coil above the sample. The pulser and display unit is a commercially available time-domain reflectometer.
Keywords
eddy currents; electrical conductivity measurement; 300 to 6 x 107 mho/m; conductive plating thickness measurement; conductivity measurements; flat surface samples; metals; noncontacting measurement; nondestructive transient eddy current testing technique; plating thickness range 0.1 to 50 micron; semiconductors; time domain reflectometer; Coils; Conductivity; Impedance; Semiconductor device measurement; Substrates; Thickness measurement;
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
ISSN
0018-9456
Type
jour
DOI
10.1109/TIM.1976.6312343
Filename
6312343
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