DocumentCode :
129483
Title :
mDTM: Multi-objective dynamic thermal management for on-chip systems
Author :
Khdr, Heba ; Ebi, Thomas ; Shafique, Muhammad ; Amrouch, Hussam ; Karlsruhe, Jorg Henkel
Author_Institution :
Dept. for Embedded Syst., Inst. of Technol. (KIT), Karlsruhe, Germany
fYear :
2014
fDate :
24-28 March 2014
Firstpage :
1
Lastpage :
6
Abstract :
Thermal hot spots and unbalanced temperatures between cores on chip can cause either degradation in performance or may have a severe impact on reliability, or both. In this paper, we propose mDTM, a proactive dynamic thermal management technique for on-chip systems. It employs multi-objective management for migrating tasks in order to both prevent the system from hitting an undesirable thermal threshold and to balance the temperatures between the cores. Our evaluation on the Intel SCC platform shows that mDTM can successfully avoid a given thermal threshold and reduce spatial thermal variation by 22%. Compared to state-of-the-art, our mDTM achieves up to 58% performance gain. Additionally, we deploy an FPGA and IR camera based setup to analyze the effectiveness of our technique.
Keywords :
integrated circuit reliability; thermal management (packaging); FPGA; IR camera; Intel SCC platform; mDTM; multiobjective dynamic thermal management technique; on-chip systems; reliability; spatial thermal variation reduction; thermal hot spots; thermal threshold; History; Member and Geographic Activities Board committees; System-on-chip; Temperature; Temperature measurement; Temperature sensors; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
Conference_Location :
Dresden
Type :
conf
DOI :
10.7873/DATE.2014.343
Filename :
6800544
Link To Document :
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