• DocumentCode
    1295267
  • Title

    Testing Methodology of Embedded DRAMs

  • Author

    Yang, Hao-Yu ; Chang, Chi-Min ; Chao, Mango C -T ; Huang, Rei-Fu ; Lin, Shih-Chin

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • Volume
    20
  • Issue
    9
  • fYear
    2012
  • Firstpage
    1715
  • Lastpage
    1728
  • Abstract
    The embedded-DRAM (eDRAM) testing mixes up the techniques used for DRAM testing and SRAM testing since an eDRAM core combines DRAM cells with an SRAM interface (the so-called 1T-SRAM architecture). In this paper, we first present our test algorithm for eDRAM testing. A theoretical analysis to the leakage mechanisms of a switch transistor is also provided, based on that we can test the eDRAM at a higher temperature to reduce the total test time and maintain the same retention-fault coverage. Finally, we propose a mathematical model to estimate the defect level caused by wear-out defects under the use of error-correction-code circuitry, which is a special function used in eDRAMs compared to commodity DRAMs. The experimental results are collected based on 1-lot wafers with an 16 Mb eDRAM core.
  • Keywords
    DRAM chips; SRAM chips; integrated circuit testing; mathematical analysis; 1-lot wafers; 1T-SRAM architecture; DRAM cells; SRAM interface; SRAM testing; eDRAM core; eDRAM testing; embedded DRAM testing methodology; error-correction-code circuitry; leakage mechanisms; mathematical model; retention-fault coverage; switch transistor; wear-out defects; Algorithm design and analysis; Error correction codes; Mathematical model; Random access memory; Testing; Embedded-DRAM (eDRAM); error-correction-code; fault model; retention;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2011.2161785
  • Filename
    5981413