DocumentCode
1295267
Title
Testing Methodology of Embedded DRAMs
Author
Yang, Hao-Yu ; Chang, Chi-Min ; Chao, Mango C -T ; Huang, Rei-Fu ; Lin, Shih-Chin
Author_Institution
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume
20
Issue
9
fYear
2012
Firstpage
1715
Lastpage
1728
Abstract
The embedded-DRAM (eDRAM) testing mixes up the techniques used for DRAM testing and SRAM testing since an eDRAM core combines DRAM cells with an SRAM interface (the so-called 1T-SRAM architecture). In this paper, we first present our test algorithm for eDRAM testing. A theoretical analysis to the leakage mechanisms of a switch transistor is also provided, based on that we can test the eDRAM at a higher temperature to reduce the total test time and maintain the same retention-fault coverage. Finally, we propose a mathematical model to estimate the defect level caused by wear-out defects under the use of error-correction-code circuitry, which is a special function used in eDRAMs compared to commodity DRAMs. The experimental results are collected based on 1-lot wafers with an 16 Mb eDRAM core.
Keywords
DRAM chips; SRAM chips; integrated circuit testing; mathematical analysis; 1-lot wafers; 1T-SRAM architecture; DRAM cells; SRAM interface; SRAM testing; eDRAM core; eDRAM testing; embedded DRAM testing methodology; error-correction-code circuitry; leakage mechanisms; mathematical model; retention-fault coverage; switch transistor; wear-out defects; Algorithm design and analysis; Error correction codes; Mathematical model; Random access memory; Testing; Embedded-DRAM (eDRAM); error-correction-code; fault model; retention;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2011.2161785
Filename
5981413
Link To Document