DocumentCode :
1295487
Title :
Micromachined inertial measurement unit fabricated by a SOI process with selective roughening under structures
Author :
Honglong Chang ; Jianbing Xie ; Qianyan Fu ; Qiang Shen ; Weizheng Yuan
Author_Institution :
Micro & Nano Electromech. Syst. Lab., Northwestern Polytech. Univ., Xi´an, China
Volume :
6
Issue :
7
fYear :
2011
fDate :
7/1/2011 12:00:00 AM
Firstpage :
486
Lastpage :
489
Abstract :
A reduced micromachined inertial measurement unit (MIMU) was fabricated by a proposed two-step release silicon-on-insulator (SOI) process to meet the requirements of land vehicle navigation. The release process consists of two steps, that is, dry release using notching effect and wet release using hydrogen fluoride (HF) solution. By applying the presented layout design rules, most of the area of the device was released in the dry-etching process, but boundaries of the proof mass and the suspension beams were not released until the wet etching. Through such a process configuration, a smooth surface was obtained under some thickness-senstive structures such as suspension beams and a rough surface under some thickness-non-sensitive structures such as proof mass. The smooth surface avoids both the defects and the loss to the thickness brought about by the notching effect that is helpful to improve the reliability of the MEMS devices. The rough surface avoids the stiction under structures with a large area. A reduced MIMU was fabricated by such a process. The test results showed that scale factors of the X/Y-axis accelerometer and Z-axis gyroscope were about 19.11 mV/g and 15.6 mV/°/s at one atmosphere, respectively. The bias stability of the gyroscope was about 129.6°/h with a resolution of 0.0224 /°s/ Hz.
Keywords :
etching; gyroscopes; inertial navigation; inertial systems; micromechanical devices; silicon-on-insulator; MEMS device; SOI process; bias stability; dry etching process; dry release; gyroscope; land vehicle navigation; micromachined inertial measurement unit; notching effect; selective roughening; suspension beams; two step release silicon-on-insulator process; wet release;
fLanguage :
English
Journal_Title :
Micro & Nano Letters, IET
Publisher :
iet
ISSN :
1750-0443
Type :
jour
DOI :
10.1049/mnl.2011.0120
Filename :
5981649
Link To Document :
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