• DocumentCode
    129558
  • Title

    Two-way quality assessment approach for tumour detection using free-hand strain imaging

  • Author

    Hyder, Safeer ; Harput, Sevan ; Alomari, Zainab ; Freear, Steven

  • Author_Institution
    Ultrasound Group, Univ. of Leeds, Leeds, UK
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    1853
  • Lastpage
    1856
  • Abstract
    A novel two-way image quality assessment method is proposed for free-hand strain imaging. In elasticity imaging, tissue with different stiffness exhibit varying contrast in the strain images and detectability of a lesion is measured using elastographic contrast-to-noise ratio (CNRe). Representing quality of strain images quantitatively is vital for improving imaging techniques and also for clinical diagnosis. It avoids the subjective approach of interpreting strain images. Conventionally, contrast between stiff lesion and surrounding soft tissue is measured using contrast-to-noise ratio and strain image with the highest CNRe amplitude is considered an optimal strain image. However experimental results have suggested that merely CNRe metric is often misleading and does not always represent the true elastic modulus contrast as the correlation coefficient falls below an acceptable levels and accuracy is compromised. Therefore in this study, the objective is to propose a comprehensive strain image quality assessment method which is reliable for clinical examinations and research.
  • Keywords
    biomechanics; biomedical ultrasonics; elastic moduli; elasticity; tumours; clinical diagnosis; elasticity imaging; elastographic contrast-noise ratio; free hand strain imaging; lesion detectability; stiff lesion; strain image contrast; surrounding soft tissue; tissue stiffness; true elastic modulus contrast; tumour detection; two way image quality assessment approach; Acoustics; Imaging phantoms; Lesions; Phantoms; Strain; Ultrasonic imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0460
  • Filename
    6932019