Thermal evaluation of a PowerPC 6201 microprocessor in a multiprocessor computer

Author

Wong, Henry ; Lee, T.-Y.T.

Author_Institution

Comput. Group, Motorola Inc., Tempe, AZ, USA

Volume

19

Issue

4

fYear

1996

fDate

12/1/1996 12:00:00 AM

Firstpage

469

Lastpage

477

Abstract

Passive heat sinks for cooling the PowerPC 620 microprocessor in a multiprocessor computer system were analyzed. A computational fluid dynamics simulation was used to determine the airflow and air temperatures at the system and board levels. A heat sink was chosen based on estimated thermal requirements and then characterized experimentally under similar flow and geometry conditions found in the system. Data from the simulation and experiments was then combined to calculate junction temperature. Results show the microprocessor junction temperature can be maintained below 85°C for a 25 W heat dissipation and 101°C for a 30 W heat dissipation

Keywords

cooling; heat sinks; integrated circuit packaging; microprocessor chips; 25 to 30 W; 85 to 101 degC; PowerPC 6201 microprocessor; air temperatures; airflow; computational fluid dynamics simulation; cooling; geometry conditions; heat dissipation; junction temperature; multiprocessor computer; passive heat sinks; thermal evaluation; Computational fluid dynamics; Computational modeling; Cooling; Fans; Geometry; Heat sinks; Manufacturing; Microprocessors; Temperature; Thermal management; Trigeneration;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.554927

Filename

554927