Title :
Thermal evaluation of a PowerPC 6201 microprocessor in a multiprocessor computer
Author :
Wong, Henry ; Lee, T.-Y.T.
Author_Institution :
Comput. Group, Motorola Inc., Tempe, AZ, USA
fDate :
12/1/1996 12:00:00 AM
Abstract :
Passive heat sinks for cooling the PowerPC 620 microprocessor in a multiprocessor computer system were analyzed. A computational fluid dynamics simulation was used to determine the airflow and air temperatures at the system and board levels. A heat sink was chosen based on estimated thermal requirements and then characterized experimentally under similar flow and geometry conditions found in the system. Data from the simulation and experiments was then combined to calculate junction temperature. Results show the microprocessor junction temperature can be maintained below 85°C for a 25 W heat dissipation and 101°C for a 30 W heat dissipation
Keywords :
cooling; heat sinks; integrated circuit packaging; microprocessor chips; 25 to 30 W; 85 to 101 degC; PowerPC 6201 microprocessor; air temperatures; airflow; computational fluid dynamics simulation; cooling; geometry conditions; heat dissipation; junction temperature; multiprocessor computer; passive heat sinks; thermal evaluation; Computational fluid dynamics; Computational modeling; Cooling; Fans; Geometry; Heat sinks; Manufacturing; Microprocessors; Temperature; Thermal management; Trigeneration;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
