DocumentCode :
1295822
Title :
Design considerations for air cooling electronic systems in high altitude conditions
Author :
Belady, Christian L.
Author_Institution :
Convex Div., Hewlett-Packard Co., Richardson, TX, USA
Volume :
19
Issue :
4
fYear :
1996
fDate :
12/1/1996 12:00:00 AM
Firstpage :
495
Lastpage :
500
Abstract :
This paper provides an overview of the effects of altitude on electronics cooling. MIL-STD 210 is reviewed to demonstrate the relationship of altitude to density as well as to outside air temperature. Once these relationships are understood the paper discusses the impact of altitude on the performance of air moving devices using the widely accepted fan laws. A discussion of both constant speed and altitude compensating fans addresses performance issues such as power dissipation, pressure drop, and free delivery of fans under these conditions. Once the fan performance has been characterized, the system impedance (or pressure drop) must be determined for the appropriate altitude. The paper covers how system impedance changes under laminar and turbulent flow regimes as altitude varies. The impact of altitude on heat transfer is also discussed along with the effects of operating in the turbulent and laminar regimes. In order to demonstrate the concepts, an example problem is worked out
Keywords :
cooling; flow; laminar flow; packaging; pressure; turbulence; MIL-STD 210; air cooling; air moving devices; altitude compensating fans; constant speed fans; electronic systems; fan laws; heat transfer; high altitude conditions; laminar flow regime; power dissipation; pressure drop; system impedance; turbulent flow regime; Ducts; Electronics cooling; Equations; Fans; Heat transfer; Hydraulic diameter; Impedance; Ocean temperature; Power dissipation; Sea level; Temperature; Thermal conductivity;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/95.554930
Filename :
554930
Link To Document :
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