A closed form solution of junction to substrate thermal resistance in semiconductor chips

Author

Masana, Francesc N.

Author_Institution

Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain

Volume

19

Issue

4

fYear

1996

fDate

12/1/1996 12:00:00 AM

Firstpage

539

Lastpage

545

Abstract

The model presented in this work is based on an extension of the constant angle heat spreading, taking into account chip and substrate dimensions, and changing the spreading angle accordingly. This yields to closed form expressions accurate enough for most practical applications. Circular, square, and rectangular geometries have been analyzed and the results compared with Bessel and Fourier series-like solutions

Keywords

Bessel functions; Fourier series; integrated circuit modelling; integrated circuit packaging; thermal resistance; Bessel series-like solutions; Fourier series-like solutions; circular geometries; closed form solution; constant angle heat spreading; junction to substrate thermal resistance; rectangular geometries; semiconductor chips; square geometries; substrate dimensions; Boundary conditions; Closed-form solution; Convergence of numerical methods; Electronic packaging thermal management; Geometry; Power system modeling; Resistance heating; Substrates; Thermal conductivity; Thermal resistance;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.554935

Filename

554935