Title :
In-process board warpage measurement in a lab scale wave soldering oven
Author :
Stiteler, Michael R. ; Ume, I. Charles ; Leutz, Brian
Author_Institution :
Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
12/1/1996 12:00:00 AM
Abstract :
An automated on-line warpage measurement system for printed wiring boards (PWBs) and printed wiring board assemblies (PWBAs) has been developed. The system is capable of simulating a variety of soldering processes, including the wave soldering process, and performing real-time PWB/PWBA warpage measurements using the shadow moire technique. The system can be used to characterize the warpage behavior of virtually any PWB/PWBA during the soldering process. Using this system, warpage of PWB test vehicles was measured during simulated wave soldering. The measured warpage varied significantly during wave soldering from that observed both before and after wave soldering. These results help us to understand how the board deforms at every stage of the soldering process
Keywords :
automatic test equipment; deformation; displacement measurement; light interferometry; moire fringes; printed circuit manufacture; printed circuit testing; production engineering computing; production testing; real-time systems; temperature distribution; wave soldering; PWB assemblies; automated online measurement system; board deformation; in-process board warpage measurement; lab scale wave soldering oven; printed wiring boards; real-time warpage measurements; shadow moire technique; soldering processes simulation; wave soldering process; Assembly systems; Electronics packaging; High speed integrated circuits; Integrated circuit packaging; Lead; Manufacturing; Ovens; Performance evaluation; Real time systems; Soldering; Surface-mount technology; System testing; Vehicles; Wiring;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
